[ibis-macro] Fw: Re: What I learned at DesignCon about PDN simulations.

  • From: Gregory R Edlund <gedlund@xxxxxxxxxx>
  • To: ibis-macro@xxxxxxxxxxxxx
  • Date: Thu, 6 Feb 2014 09:31:37 -0600

From:   Gregory R Edlund/Rochester/IBM
To:     wkatz@xxxxxxxxxx, "Bradley Brim" <bradb@xxxxxxxxxxx>,
Cc:     "IBIS-ATM" <ibis-macro@xxxxxxxxxxxxx>,
            ibis-macro-bounce@xxxxxxxxxxxxx
Date:   02/06/2014 08:57 AM
Subject:        Re: [ibis-macro] Re: What I learned at DesignCon about PDN
            simulations.


Walter, Brad, & IBIS Folks,

We've been talking about this internally off and on for some time.  There
is definitely a need to account for supply noise in our AMI simulations.
Right now, the jitter parameters are the best way to do this.   (Correct me
if I haven't been keeping up.)  This involves the model builder translating
voltage noise into jitter in some simulation environment outside of IBIS.
I wonder how many companies actually attempt SSO analysis anymore?  I'd be
willing to bet we could count them on one hand.  It seems everyone is
farming their design work out.  That makes me question the business sense
of implementing the necessary features in IBIS.  How could simulator
companies recover their investment when the customer base is so small?

Greg Edlund
Senior Engineer
Signal Integrity and System Timing
IBM Systems & Technology Group
3605 Hwy. 52 N  Bldg 050-3
Rochester, MN 55901





From:   Walter Katz <wkatz@xxxxxxxxxx>
To:     "Bradley Brim" <bradb@xxxxxxxxxxx>, "IBIS-ATM"
            <ibis-macro@xxxxxxxxxxxxx>,
Date:   02/04/2014 07:22 AM
Subject:        [ibis-macro] Re: What I learned at DesignCon about PDN
            simulations.
Sent by:        ibis-macro-bounce@xxxxxxxxxxxxx



Brad,

Again, your points are well taken. First, parallel interfaces are now
exceeding 2GBps. Although S parameters might be overkill at these data
rates, there are IC Vendors who are using “swathing” techniques for
parallel interfaces with parameterized SPICE circuits. 11-WE7 would have
been an ideal forum, but there was only enough time for one or two
questions at the end. SSO analysis is important – the current state of the
art is to include this noise in added timing margins and noise margins. So
the answer is yes, I believe that IBIS should be including SSO macro
models, but this traditionally has been beyond the scope of “Buffer”
models. So to answer your question, yes IBIS-AIM (or another IBIS AdHoc
committee would be an excellent forum for discussing adding PDN macro
modeling to the IBIS standard.

Walter

From: Bradley Brim [mailto:bradb@xxxxxxxxxxx]
Sent: Monday, February 03, 2014 11:40 PM
To: wkatz@xxxxxxxxxx; IBIS-ATM
Subject: RE: What I learned at DesignCon about PDN simulations.

Hi Walter,

Interested to learn in more detail your perception of requirements by
“system integrators” for PDN and power-aware SI design. Does you comment
apply to both serdes and parallel bus designs? DesignCon 2014 panel session
11-WE7 would have been an ideal forum in which to discuss this topic.

Does your text below imply you believe system integrators only require
enough information to select and place PCB decaps that are effective to
~25MHz. You seem to imply there is no need (nor available info or tools)
for system integrators to pursue analyses such as SSO and performance for
this should be assured apriori by packaged device vendors. If this is the
case, seems difficult for system integrators to characterize their designs
for noise margin compliance. Maybe you propose some form of PDN macromodel
noise specification and a manner in which to include this in power-aware SI
verification analyses? If so, an interesting idea. Has such been proposed
or presented previously (e.g. at DesignCon) that you can cite for us? Seems
a perfect topic for a few DesignCon tracks: system, PI or PCB.

What is your goal in initiating the discussion with IBIS-ATM? Maybe a PDN
macromodel specification as part of IBIS? If it’s not already established
in the literature is ATM the proper forum to propose and prove-out such PDN
macromodel approach?

Cheers,
-Brad

From: ibis-macro-bounce@xxxxxxxxxxxxx [
mailto:ibis-macro-bounce@xxxxxxxxxxxxx] On Behalf Of Walter Katz
Sent: Monday, February 03, 2014 10:35 AM
To: IBIS-ATM
Subject: [ibis-macro] What I learned at DesignCon about PDN simulations.

All,

There were a large number of papers at DesignCon about PDN, and all pretty
much said the same thing – it is all now a Science Experiment. Although the
composite current now in IBIS is part of the solution, the real problem is
how to apply composite current on all the buffers to determine the current
requirements on chip. One needs both the spectral content of the total
current on each rail and the phase (i.e. what buffers are transitioning
when). A SerDes bus will normally have all Tx transitioning at more or less
random times. This is assured by the data patterns being 8B10, or
scrambled. DDR DQ memory busses can have more regular patterns (e.g.
sending lots of 0 data with bursts of all 1’s or random data. This gets
even more complicated for chips used in Mobile devices where whole sections
of a chip can be turned on or off to conserve power. These problems need to
be addressed by having sufficient on-die rail capacitance and sufficient
package capacitance. In addition, there needs to be sufficient capacitors
on the board. This on-die and package capacitance requirements need to be
addressed by the IC Vendor, requiring very detailed knowledge of the
current requirements for each buffer (e.g. IBIS composite current),
detailed knowledge of the spectral density and phase of the buffer
switching, and detailed power models on-die and in package. The systems
integrator will not have access to this type of information or the
simulation tools required to do these types of analysis. The systems
integrator does need to insure that he has sufficient  bypass capacitors
and power distribution on the board to supply current to the package. This
is  a ~25MegHz problem, not a ~GHz problem required by the chip/package
tool.

The bottom line is that we should not confuse the PDN modeling requirements
of the Chip/Package tools and the PDN modeling requirements for the System
Integrator.

Walter

Walter Katz
wkatz@xxxxxxxxxx
Phone 303.449-2308
Mobile 303.335-6156

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