Brad, I have submitted a proposal called Electronic Module Description (EMD), which references Spice subckts. We put that aside to define the syntax or SPICE dialect we would support in EMD. This was the Raison d'être for IBIS Interconnect Spice. IBIS Interconnect Spice is really a sidebar for EMD. I think we should be focusing on EMD and how we wrap SPICE subckts. As a matter of fact, all of the interconnect subckts that we as EDA companies create or use are de facto Hspice compliant, and use the subset of Hspice that are in the proposed IBIS Interconnect Spice Dialect. I am enclosing the original presentation I made to IBIS ATM in March 2008. On slide 15 I referred to ?IBIS Spice? Meta format (slide 15). Subsequently, IBIS ATM agreed that a subset of HSPICE would be preferable to creating a new SPICE dialect, and Synopsys graciously agreed to allow putting this subset of their documentation into the public domain. Now that we have essentially agreed to the subset of HSPICE documentation we would be using to define the IBIS Interconnect Spice Dialect, we need to decide in what format we are going to publish this dialect. I actually would want to poll the EDA companies sooner rather than later. I think if all of the EDA companies will not support IBIS Interconnect Spice Dialect today then I do not think we need to waste my time, or anyone else?s time anymore on this and on EMD. Walter -----Original Message----- From: Brad Brim [mailto:bradb@xxxxxxxxxxx] Sent: Friday, June 05, 2009 1:25 PM To: wkatz@xxxxxxxxxx; 'IBIS Macro' Subject: RE: [ibis-macro] IBIS Interconnect Spice Dialect ... hi Walter, Thanks much for all your effort. This would not be moving so quickly without all your mentoring. You stated, "IBIS is planning to introduce new methods of modeling connector, package and module interconnect." Does the IBIS committee really have a documented short or intermediate term goal of doing this? If not, then let's not make such statement here. In my opinion, your paragraph is better without the first two sentences. Stating in the proposal which EDA companies register support for it seems like an early and potentially redundant vote/polling of the EDA companies. best regards, -Brad _____ From: ibis-macro-bounce@xxxxxxxxxxxxx [mailto:ibis-macro-bounce@xxxxxxxxxxxxx] On Behalf Of Walter Katz Sent: Friday, June 05, 2009 9:37 AM To: IBIS Macro Subject: [ibis-macro] IBIS Interconnect Spice Dialect ... All, I will be somewhere between Philadelphia and NYC during next Tuesday?s meeting, so I may not be able to attend. I think the document I sent out after this past Tuesday?s meeting is very close to fully defining the subset of HSPICE that we intend to support. It requires careful review. I think we are now at the stage to decide what formal final document we would want to submit to the Open Forum to approve. I would like us to consider making this document with out any significant changes as the definition of the IBIS Interconnect Spice Dialect, and something like the following to the IBIS Open Forum: IBIS is planning to introduce new methods of modeling connector, package and module interconnect. Each of these new modeling standards will require the need to use SPICE subckts. Because of the large number of SPICE dialects, IBIS ATM has determined the need for a ?least common denominator? SPICE dialect called IBIS Interconnect Spice Dialect. Synopsys has given us approval to use HSPICE documentation to define this dialect. The attached document was generated bys cutting and pasting directly from the Synopsys HSPICE manuals. A SPICE subckt is IBIS Interconnect Spice compliant if it follows the syntactical rules described in this document. Below is a list of EDA vendors that have agreed to support this SPICE dialect in subckts in their EDA tools. The IBIS ATM committee hereby request that the enclosed document be approved as the IBIS Interconnect Spice Dialect. List of EDA Vendors registering support for this SPICE dialect. Signal Integrity Software, Inc. Synopsys ? I think that this approach can get this done very quickly, and we can move on to using these SPICE subckts in package, connector and module models. Walter Walter Katz Chief Scientist Signal Integrity Software, Inc. wkatz@xxxxxxxxxx 303.449-2308