I would like to let everyone know that we are going to discuss the IC vendor's perspective on IBIS package modeling in the ATM teleconference tomorrow, and I would like to encourage the IBIS representatives of IC and/or package vendors to attend the meeting so that we could have a productive discussion. Mike Mirmak will give us an overview of Intel's package modeling practices and hopefully give us some thoughts on which direction IBIS should take in order to be useful for Intel's modeling needs. I would like to have other IC and/or package vendors to be present so that they can also express their views on the topic, because I don't want to end up with a specification that is tailored to one company's needs only. Questions I would like to find answer to are along the lines of why the current IBIS package modeling is not useful for the industry and what should the IBIS specification be improved to make it useful again. We know that the RLC or ideal T-line currently available in IBIS is way too inadequate for GHz designs. We would like to utilize the IBIS-ISS capabilities to improve on that. But do we have problems with the current syntax in the way package models are referenced and instantiated in the .ibs file? Do we need a different way of doing that? If so how? Etc... I think these meetings are important historic moments in IBIS. We have the rare opportunity to define new directions, which doesn't happen very frequently. I would like to encourage everyone to participate in these discussions so that we can find a useful solution for the needs of the industry and make IBIS useful for package modeling also. Thanks, Arpad ===============================================================