[ibis-macro] Re: Minutes from the 9 Dec 2008 ibis-atm meeting
- From: "Muranyi, Arpad" <Arpad_Muranyi@xxxxxxxxxx>
- To: "IBIS-ATM" <ibis-macro@xxxxxxxxxxxxx>
- Date: Tue, 16 Dec 2008 08:30:30 -0800
Eckhard,
Thanks for your comments. I apologize for being
repetitive, but if the answer to your first question
is yes, we would like to do all that, then we might
as well turn to VHDL-AMS or Verilog-AMS which do
have these capabilities already. We don't need to
reinvent the wheel. The only problem is that the
*-AMS languages are also missing a few things which
we would need to figure out how to address, and then
the unfamiliarity and strongly typed nature of VHDL-AMS
is another stumbling block, along with the expenses of
building an engine for those EDA people who don't have
it yet, etc...
Regarding the second question, I think input/output
is not sufficient. We need to include package/connector
(interconnect) capabilities and at least SI/PI if not
more.
Arpad
=========================================================
-----Original Message-----
From: ibis-macro-bounce@xxxxxxxxxxxxx [mailto:ibis-macro-bounce@xxxxxxxxxxxxx]
On Behalf Of Lenski, Eckhard (NSN - DE/Munich)
Sent: Monday, December 15, 2008 9:30 AM
To: milabont@xxxxxxxxx; IBIS-ATM
Subject: [ibis-macro] Re: Minutes from the 9 Dec 2008 ibis-atm meeting
Hello all,
Some simple questions from a newcomer to ibis macro:
Last week we discussed what might be needed for the future ibis.
So here I a have some general questions:
1) range of model / should we have a multiphysic model in mind or not
What do we need to model/ what shall the model be used for ?
Usage of model for
- SI
- PI
- EMI
- mechanical ( eq. do we need information about the size/ the material )
- optical ( fiber optical tranceivers )
- thermal ( heating of the die )
2) IBIS for input and output only
IBIS as today just for input and output
Or with some information about the core ( for EMI and PI probably needed )
( having in mind, that with the AMI approach we are already going beyond the
input-stage ( equalization ))
Best regards
Eckhard Lenski
Mit freundlichen Grüßen / Best regards / Cordiali saluti / ystävällisin
terveisin
Eckhard Lenski
Nokia Siemens Networks GmbH & Co. KG
COO RA GERD BTS BR PDev CAE Lib&IBIS
CAE libraries and models
Balanstr. 59
81541 München
Germany
phone : +49 89 636 79002
fax : +49 89 636 78895
email: eckhard.lenski@xxxxxxx
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