[ibis-macro] Package and On-Die Modeling
- From: "Walter Katz" <wkatz@xxxxxxxxxx>
- To: "IBIS-ATM" <ibis-macro@xxxxxxxxxxxxx>
- Date: Tue, 10 Jul 2012 16:05:32 -0400 (EDT)
Example Component
Router Fabric Chip
802.3KR Interface
128 bit SerDes Differential, Output
32 Four Channel Lanes
Each Four Channel Lane goes to a different Line Card
128 bit SerDes Differential, Input
32 Four Channel Lanes
Each Four Channel Lane goes to a different Line Card
DDR3 Interface
4 Sixteen bit, Single Ended, Bi-Directional, IO, DQ Data bits
Each Sixteen bit lane goes to a different DDR3 memory chip
Twenty Three bit, Single Ended, Output, Address/Control bus
One Differential, Bi-Directional, IO, DQS Strobe line
SATA II Interface
Sixteen bit SerDes Differential, Output
Sixteen bit SerDes Differential, Input
Power
802.3KR Interface
VKR, GND
DDR3 Interface
VDDR, GND
SATA II Interface
VSATA, GND
Component
Pins
665 Signal
128*2+128*2+64+23+1*2+16*2+16*2
600 GND
200 VKR
64 VDDR3
8 VSATA
Bump Pads
665 Signal
300 GND
100 VKR
50 VDDR3
16 VSATA
Uncoupled Signal Models
Package
87 Two port single ended IBIS-ISS subckts
289 Four port differential IBIS-ISS subckts
On-Die
87 Two port single ended IBIS-ISS subckts
289 Four port differential IBIS-ISS subckts
Simulation
Output Buffer Models
Output On-Die Model
Output Package Model
Board Model
Connector Model(s)
Board Model(s)
Input Package Model
Input On-Die Model
Input Buffer Models
Input and Output on same Chip?
Focusing on just the 128 bit 802.3KR Output Bus
"Full" Model
Package Model Ports
Pin Ports
256 (128 Differential) Signal Pins
600 GND Pins
200 VKR Pins
Bump Pad Ports
256 Signal Bump Pads
300 GND Bump Pads
100 VKR Bump Pads
On-Die Model Ports
Buffer Ports
256 (128 Differential) Signal Buffer Pads
128 GND Buffer Pads
128 VKR Buffer Pads
Bump Pad Ports
256 Signal Bump Pads
300 GND Bump Pads
100 VKR Bump Pads
"Low Frequency" Model
Package Model Ports
Pin Ports
256 (128 Differential) Signal Pins
20 GND Pins
10 VKR Pins
Bump Pad Ports
256 Signal Bump Pads
1 GND Bump Pads
1 VKR Bump Pads
On-Die Model Ports
Buffer Ports
256 (128 Differential) Signal Buffer Pads
1 GND Buffer Pads
1 VKR Buffer Pads
Bump Pad Ports
256 Signal Bump Pads
1 GND Bump Pads
1 VKR Bump Pads
"Mid Frequency" Model
Package Model Ports
Pin Ports
256 (128 Differential) Signal Pins
100 GND Pins
50 VKR Pins
Bump Pad Ports
256 Signal Bump Pads
1 GND Bump Pads
1 VKR Bump Pads
On-Die Model Ports
Buffer Ports
256 (128 Differential) Signal Buffer Pads
1 GND Buffer Pads
1 VKR Buffer Pads
Bump Pad Ports
256 Signal Bump Pads
1 GND Bump Pads
1 VKR Bump Pads
"High Frequency" Model
Package Model Ports
Pin Ports
256 (128 Differential) Signal Pins
1 GND Pins
1 VKR Pins
Bump Pad Ports
256 Signal Bump Pads
25 GND Bump Pads
25 VKR Bump Pads
On-Die Model Ports
Buffer Ports
256 (128 Differential) Signal Buffer Pads
25 GND Buffer Pads
25 VKR Buffer Pads
Bump Pad Ports
256 Signal Bump Pads
25 GND Bump Pads
25 VKR Bump Pads
"High Frequency" Model, 8Bit Slice
Package Model Ports
Pin Ports
16 (8 Differential) Signal Pins
1 GND Pins
1 VKR Pins
Bump Pad Ports
16 Signal Bump Pads
4 GND Bump Pads
4 VKR Bump Pads
On-Die Model Ports
Buffer Ports
16 (8 Differential) Signal Buffer Pads
1 GND Buffer Pads
1 VKR Buffer Pads
Bump Pad Ports
16 Signal Bump Pads
1 GND Bump Pads
1 VKR Bump Pads
Questions
In the Package Models
Signal/Signal Coupling
Always Signal/Signal Coupling
Sometimes Signal/Signal Coupling
Never Signal/Signal Coupling
Signal/Power Coupling
Always Signal/Power Coupling
Sometimes Signal/Power Coupling
Never Signal/Power Coupling
In the On-Die Models
Signal/Signal Coupling
Always Signal/Signal Coupling
Sometimes Signal/Signal Coupling
Never Signal/Signal Coupling
Signal/Power Coupling
Always Signal/Power Coupling
Sometimes Signal/Power Coupling
Never Signal/Power Coupling
Coupling Between Interfaces
Power
Signal
Which Models are needed by IC Vendor
Which Models are needed by System Designer
Model Connection Protocol
Defines the subckt Ports
Package Model Ports
Associates subckt Ports with
Pins, Association Done with Pin Handle
Power Pins
Ground Pins
Signal Pins
Bump Pads, Association Done with Bump Pad Handle
Power Bump Pads
Ground Bump Pads
Signal Bump Pads
Pin Handle
Component Alphanumeric Pin Number
Component Alphanumeric Signal Name
XY Location
Bump Pad Handle
Bump Pad Alphanumeric Pad Number
XY location
On-Die Model Ports
Associates subckt Ports with
Buffer Pads, Association Done with Buffer Handle
Power Buffer Pads
Ground Buffer Pads
Signal Buffer Pads
Bump Pads, Association Done with Bump Pad Handle
Power Bump Pads
Ground Bump Pads
Signal Bump Pads
Buffer Handle
Component Signal Pin
Bump Pad Handle
Bump Pad Alphanumeric Pad Number
XY location
Walter Katz
<mailto:wkatz@xxxxxxxxxx> wkatz@xxxxxxxxxx
Phone 303.449-2308
Mobile 303.335-6156
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