All, As presented in today's IBIS-ATM meeting. Walter From: ibis-macro-bounce@xxxxxxxxxxxxx [mailto:ibis-macro-bounce@xxxxxxxxxxxxx] On Behalf Of Walter Katz Sent: Tuesday, November 05, 2013 2:53 PM To: IBIS-ATM Subject: [ibis-macro] Presentation to Open Forum on Nov 1, 2013, and Re-Inventing IBIS Component/Die All, I am enclosing the presentation I gave last Friday to the Open Forum on what we have been discussing in IBIS-ATM (MM can you please post). I have also including in this e-mail some thoughts on what we have learned about chips in the last 20 years since IBIS was created and some ideas on how to re-invent IBIS to handle this. Walter Going back to basics on what we have learned in the last 20 years about Die. 1. A Die consists of: a. Die Pads i. These are xyz locations on the Die that connect to a Package 1. Bump Pads 2. Wire Bonds 3. Bottom Layer of Die ii. They can either be Signal or Supply 1. Signal Pads a. Connected to a single Buffer (aka [Model]) b. Can be paired with another Signal Pad to form a Differential Connection c. Differential Signal connect to either i. Two Single Ended Buffers ([Model]s) ii. A single differential Buffer (true differential [Model]) d. Have a Signal Name e. Have a Die Pad Number (Name) 2. Supply Pads a. Connected to one or more Buffers b. Have a Supply Name (aka Signal Name) c. Have a Die Pad Number (Name) b. Buffers i. Can be Single Ended or Differential ii. Can be Input, Output, 3-state or Bi-Directional iii. Have Signal Terminals that are connected to Signal Pad (2 if true differential) iv. Can have Control Terminals 1. Outputs a. Stimulus 2. Inputs a. Output i. Digital ii. Analog 3. I/O (Can be an Input Buffer and 3-state) (Complications) a. Stimulus b. Enable c. Output i. Digital ii. Analog 4. 3-state a. Stimulus b. Enable 5. The Control Terminal of one Buffer can be connected to a Control Terminal of another Buffer a. Example of this is a Repeater or "Buffer" or "Mux" component v. Supply Terminals 1. Required a. Pullup b. Pulldown 2. Optional a. Power Clamp b. Ground Clamp 3. Supply Terminals are associated with Supply Names a. Note that two instances of the same buffer can have different Supply Names c. On-Die Interconnect i. Connect Signal Die Pads to Buffer Signal Terminals ii. Connect Supply Die Pads to Buffer Supply Terminals iii. Connect Buffer Control Terminals 2. A way that IBIS can be enhanced to described a Die a. New key word [Die] i. [Singled Ended Signal Pad] section 1. <Die Pad Number> <Signal Name> <[Model]> <Pullup Supply Name> <Pulldown Supply Name> {<Power Clamp Supply Name> <Ground Clamp Supply Name>} ii. [Differential Signal Pad] section 1. <Die Pad Number> <Inv Die Pad Number> <Signal Name> <Inv Signal Name> <[Model]> <Pullup Supply Name> <Pulldown Supply Name> {<Power Clamp Supply Name> <Ground Clamp Supply Name> iii. [Supply Pad] section 1. <Die Pad Number> <Supply Name> <Power|Ground> 3. What would a new [Component] Section look like a. New Keyword [New Component] i. [Single Ended Signal Pin] Section 1. <Pin Number> <Signal Name> <Die Pad Number> <[Model]> ii. [Differential Signal Pin] section 1. <Pin Number> <Inv Pin Number> <Signal Name> <Inv Signal Name> 2. <Die Pad Number> <Inv Die Pad Number> <[Model]> iii. [Supply Pin] section 1. <Pin Number> <Supply Name> <Power|Ground> 4. Ports (Terminals) of Package Interconnect a. Pin Ports i. Signal Pin Numbers ii. Supply Pin Numbers b. Die Pad Ports i. Die Signal Pad Numbers ii. Die Supply Pad Numbers 5. Ports (Terminals) of On-Die Interconnect a. Die Pad Ports i. Die Signal Pad Numbers ii. Die Supply Pad Numbers b. Buffer Signal Terminals c. Buffer Supply Terminals d. Buffer Control Terminals Walter Katz <mailto:wkatz@xxxxxxxxxx> wkatz@xxxxxxxxxx Phone 303.449-2308 Mobile 303.335-6156
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