[ibis-macro] Incremental Changes to IBIS Component to handle proper power distribution models and stacked memory.
- From: Walter Katz <wkatz@xxxxxxxxxx>
- To: "IBIS-ATM" <ibis-macro@xxxxxxxxxxxxx>
- Date: Wed, 6 Nov 2013 17:33:43 -0500 (EST)
All,
If we decide to properly handle Power Distribution for Package and On-Die
interconnect models, the following incremental enhancements to the
existing IBIS Component will suffice:
Add a new Keywords [Die Supply Pad] and [Buffer Supplies] under
[Component]
Keyword: [Die Supply Pad]
Required: No
Description: Associates supply Die Pads to signal names.
Sub-Params: signal_name
Usage Rules: If this section exists, at least one supply die pad must be
specified for each signal name that is used as a Pullup Reference,
Pulldown Reference, Power Clamp Reference and Ground Clamp reference on
any [Model]. The first column must contain the die pad name. The second
column, signal_name, gives the data book name for the supply voltage on
that die pad. There must be at least on pin in the [Pin] section that has
the same signal_name. All pins in the [Pin] section that have the same
signal_name must have a model_name of either POWER or GND. All pins in the
[Pin] section that have the same signal_name cannot have a mixture of
model_names POWER or GND.
Column length limits are:
[Die Supply Pad] 40 characters max
signal_name 40 characters max
Example:
[Die Supply Pad]
VCC_1 VCC
VCC_2 VCC
VCC_3 VCC
VSS_1 VSS
VSS_2 VSS
VDD_1 VDD
VDD_2 VDD
Keyword: [Buffer Supplies]
Required: No
Description: Associates model reference voltages with signal_names
Sub-Params: pullup_signal_name pulldown_signal_name
power_clamp_signal_name ground_clamp_signal_name
Usage Rules: If this section exists, signal names are specified for each
buffer instance pullup, pulldown, power clampo and ground clamp reference.
The first column must contain a pin_name of a pin in the [Pin] section.
The pin in the pin section may not have model_name POWER, GND or NC. The
remaining columns specify the supply voltages for the model instance
associated with the pin_name. The second column, pullup_signal_name, gives
the data book name for the pullup reference voltage on the model. The
third column, pulldown_signal_name, gives the data book name for the
pulldown reference voltage on the model. Each line must contain either
three or five columns. If the line contains three columns, then the power
clamp reference is the same as the pullup reference, and the ground clamp
reference is the same as the pulldown referenc. If there is five columns,
then column four is the power_clamp_signal_name and column five is the
ground_clamp_signal_name.
Column length limits are:
[Buffer Supplies] 5 characters max
pullup_signal_name 40 characters max
pulldown_signal_name 40 characters max
power_clamp_signal_name 40 characters max
ground_clamp_signal_name 40 characters max
Example:
[Buffer Supplies] signal_name|
A1 VCC VSS
A2 VCC VSS
A3 VCC VSS VDD VSS
A4 VCC VSS VDD GND
If we decide to handle Stacked Memory, the following incremental
enhancements to the existing IBIS Component will suffice:
Add a new Keywords [Stacked Memory] and [Pin Stacking] under [Component]
Keyword: [Stacked Memory]
Required: No
Description: Tells the number of die that are stacked in this
component.
Usage Rules: The field must be a positive decimal integer greater than
one. Each die shall be labeled 1, 2, ..N, where N is the number of dice
specified in the [Stacked Memory] record. Which die each signal pin (pins
in the [Pin] section that do not have model_name POWER, GND, or NC) is
specified in the [Pin Stacking] section. If there is a Die Supply Pad
section, then it shall be assumed that all Die Supply Pads are available
on each die.
Example:
[Stacked Memory] 4
Keyword: [Pin Stacking]
Required: No
Description: Tells the dies that each pin is connected to.
Usage Rules: The first field is a pin_name of a pin in the [Pin]
section. This pin may not have model_name POWER, GND or NC. There shall be
up to N additional fields, where N is the number of dice specified in the
[Stacked Memory] record. Each field shall be an integer number from 1 to
N. All fields must be unique. The numbers specified on each record tell
which die this pin is connected to. A pin may only occur only once in this
section.
Example:
[Pin Stacking]
A1 1 2 3 4
A2 1 2 3 4
B1 1
B2 2
B3 3
B4 4
C1 1 2
C2 3 4
If someone wished to support handling multiple pins in the [Pin] section
connected to a single buffer, or a single pin in the [Pin] section
connected to multiple buffers, they should suggest enhancements to the
IBIS component section to support this functionality.
Walter
Walter Katz
<mailto:wkatz@xxxxxxxxxx> wkatz@xxxxxxxxxx
Phone 303.449-2308
Mobile 303.335-6156
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- » [ibis-macro] Incremental Changes to IBIS Component to handle proper power distribution models and stacked memory. - Walter Katz
