[ibis-macro] Overview of EMD, package and on-die interconnect IBIS Component modeling

  • From: "Walter Katz" <wkatz@xxxxxxxxxx>
  • To: "IBIS-ATM" <ibis-macro@xxxxxxxxxxxxx>
  • Date: Tue, 10 Sep 2013 07:19:43 -0400 (EDT)

All,

 

I am enclosing a presentation (based on one given to the IBIS Open Forum
on March 15) updated with the status of discussions in the IBIS Packaging
committee of applying EMD methodology to package and on-die interconnect
IBIS Component modeling.

 

Walter

 

Walter Katz

 <mailto:wkatz@xxxxxxxxxx> wkatz@xxxxxxxxxx

Phone 303.449-2308

Mobile 303.335-6156

Attachment: EMD_Package_On_Die_Interconnect.pptx
Description: application/vnd.openxmlformats-officedocument.presentationml.presentation

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