[ibis-macro] Re: Overview of EMD, package and on-die interconnect IBIS Component modeling

From: Scott McMorrow <scott@xxxxxxxxxxxxx>
Date: Tue, 10 Sep 2013 14:13:26 -0400

Bob Ross and I would like to request time from the committee to present the
following slides in today's meeting, which are germane to the discussion of
package modeling.

regards,

Scott



On Tue, Sep 10, 2013 at 7:19 AM, Walter Katz <wkatz@xxxxxxxxxx> wrote:

> All,****
>
> ** **
>
> I am enclosing a presentation (based on one given to the IBIS Open Forum
> on March 15) updated with the status of discussions in the IBIS Packaging
> committee of applying EMD methodology to package and on-die interconnect
> IBIS Component modeling.****
>
> ** **
>
> Walter****
>
> ** **
>
> Walter Katz****
>
> wkatz@xxxxxxxxxx****
>
> Phone 303.449-2308****
>
> Mobile 303.335-6156****
>
> ** **
>



-- 

Scott McMorrow
Teraspeed Consulting Group LLC
16 Stormy Brook Rd
Falmouth, ME 04105

(401) 284-1827 Business

http://www.teraspeed.com

Teraspeed® is the registered service mark of
Teraspeed Consulting Group LLC

Attachment: DDR3 Jitter vs Aggressors.pdf
Description: Adobe PDF document

Follow-Ups:
- [ibis-macro] Re: Overview of EMD, package and on-die interconnect IBIS Component modeling
  - From: Muranyi, Arpad

References:
- [ibis-macro] Overview of EMD, package and on-die interconnect IBIS Component modeling
  - From: Walter Katz

[ibis-macro] Re: Overview of EMD, package and on-die interconnect IBIS Component modeling

Other related posts: