[ibis-macro] Re: Overview of EMD, package and on-die interconnect IBIS Component modeling

From: "Muranyi, Arpad" <Arpad_Muranyi@xxxxxxxxxx>
To: IBIS-ATM <ibis-macro@xxxxxxxxxxxxx>
Date: Tue, 10 Sep 2013 18:33:02 +0000

Scott,

Thanks for your participation in this discussion.

I would like to spend a little time on having a final
discussion on BIRD 155 and hopefully vote on it to be
submitted to the Open Forum.  You can have the rest of
the time in the meeting for your slides.

Thanks,

Arpad
========================================================

From: ibis-macro-bounce@xxxxxxxxxxxxx [mailto:ibis-macro-bounce@xxxxxxxxxxxxx] 
On Behalf Of Scott McMorrow
Sent: Tuesday, September 10, 2013 1:13 PM
Cc: IBIS-ATM
Subject: [ibis-macro] Re: Overview of EMD, package and on-die interconnect IBIS 
Component modeling

Bob Ross and I would like to request time from the committee to present the 
following slides in today's meeting, which are germane to the discussion of 
package modeling.

regards,

Scott


On Tue, Sep 10, 2013 at 7:19 AM, Walter Katz 
<wkatz@xxxxxxxxxx<mailto:wkatz@xxxxxxxxxx>> wrote:
All,

I am enclosing a presentation (based on one given to the IBIS Open Forum on 
March 15) updated with the status of discussions in the IBIS Packaging 
committee of applying EMD methodology to package and on-die interconnect IBIS 
Component modeling.

Walter

Walter Katz
wkatz@xxxxxxxxxx<mailto:wkatz@xxxxxxxxxx>
Phone 303.449-2308
Mobile 303.335-6156




--

Scott McMorrow
Teraspeed Consulting Group LLC
16 Stormy Brook Rd
Falmouth, ME 04105

(401) 284-1827 Business

http://www.teraspeed.com

Teraspeed(r) is the registered service mark of
Teraspeed Consulting Group LLC

References:
- [ibis-macro] Overview of EMD, package and on-die interconnect IBIS Component modeling
  - From: Walter Katz
- [ibis-macro] Re: Overview of EMD, package and on-die interconnect IBIS Component modeling
  - From: Scott McMorrow

[ibis-macro] Re: Overview of EMD, package and on-die interconnect IBIS Component modeling

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